انتشاری تصاویری از بدنه فلزی اسمارت فون Huawei Ascend P8

At 6.5 mm, Huawei’s Ascend P7 is one of this year’s thinnest smartphones – at least if we’re talking about devices that are widely available around the world. The P7 is also one of the best Huawei handsets we’ve tested lately, so we’re genuinely interested in its successor – which, as we told you in November, should be (unsurprisingly) called Ascend P8. November was also when we heard that the P8 would have a thin metal body, just like the P7. Now, a couple of photos that allegedly show the chassis of the P8 seem to confirm that metal is indeed one of the main materials used to manufacture the new smartphone. According to Chinese website CNMO, the Ascend P8 should be released in March 2015. It’s said that the new handset will be a bit larger than the P7, sporting a 5.2-inch 1080p display, instead of a 5-inch one. Other rumored features include an octa-core Kirin 930 processor, 3 GB of RAM, 32 GB of internal memory, and a fingerprint sensor. The Ascend P8 could cost slightly less than $500, thus being a bit more affordable than most flagship smartphones are nowadays. Interested?